HP L34199-972 geheugenmodule 16 GB DDR4 260-pins SO-DIMM

The HP 16GB DDR4 3200MHz memory module is a 260-pin SO-DIMM designed for laptop use. It provides 16 GB of DDR4 internal memory running at 3200 MHz and operates at a standard 1.2 V. This module is intended as an internal memory upgrade to increase available RAM, improve multitasking, and reduce bottlenecks in everyday computing tasks.

Advantages

This HP SO-DIMM delivers a reliable capacity of 16 GB DDR4 at a 3200 MHz clock speed, providing faster data access and smoother application performance compared with lower-frequency modules. The 1.2 V operating voltage helps maintain power efficiency suitable for portable systems. The 260-pin form factor is compatible with laptops that accept SO-DIMM DDR4 modules, allowing straightforward memory expansion without modifying other system components.

Suitable for

• Upgrading laptop memory for improved multitasking and responsiveness
• Replacing a faulty or lower-capacity SO-DIMM in compatible notebooks
• Enhancing performance for office applications, web browsing, and light content creation
• Systems that require a 260-pin DDR4 SO-DIMM with 1.2 V operating voltage

Key specifications

• Capacity: 16 GB
• Type: DDR4
• Clock speed: 3200 MHz
• Form factor: 260-pin SO-DIMM
• Operating voltage: 1.2 V

How to use

Power off the laptop and disconnect all power sources, including the battery if removable. Open the memory access panel according to the laptop manufacturer’s instructions. Align the 260-pin SO-DIMM with the slot at a slight angle, insert the module into the slot, and press down gently until the retaining clips engage. Re-assemble the access panel, reconnect power, and boot the system. Confirm that the operating system recognizes the full 16 GB of memory in system settings or BIOS/UEFI.

Recommendations

Before installation, verify laptop compatibility with DDR4 SO-DIMM modules at 3200 MHz and check the maximum supported memory capacity. For optimal stability, pair this module with an identical module (same capacity, speed, and voltage) to enable dual-channel operation if supported. Handle the module by its edges and avoid touching components to reduce risk of electrostatic damage.