Kühlkörper HPE P58459-B21 breedte 252,4 mm diepte 287,3 mm hoogte 135 mm

The HPE P58459-B21 heatsink is designed to provide stable thermal management for compatible HP Enterprise systems. Measuring 252.4mm in width, 287.3mm in depth and 135mm in height, this heatsink helps dissipate heat from critical components to support reliable operation under sustained loads. Its form factor and thermal characteristics are intended to fit specified server or compute modules where efficient passive or active cooling is required.

Advantages

The heatsink's precise dimensions make it suitable for installations where clearance and airflow are constrained. By removing heat from processors or other high-temperature components, it contributes to system stability and can help extend component lifetime. The design is focused on compatibility with HP Enterprise platforms and on maintaining consistent thermal performance in demanding operating conditions.

Suitable for

• Server and enterprise compute modules requiring a compatible heatsink form factor
• Systems with limited internal clearance where specified dimensions are required
• Environments where sustained thermal dissipation is necessary to maintain performance

Key specifications

• Width: 252.4 mm
• Depth: 287.3 mm
• Height: 135 mm
• Application: Thermal dissipation for enterprise-class systems
• Compatibility: Designed for HP Enterprise platforms (physical and thermal fit dependent on system model)

How to use

Install the heatsink according to the host system manufacturer's instructions. Ensure the system is powered down and disconnected from power before beginning installation. Align the heatsink with the designated mounting points and secure it using the recommended fasteners or retention mechanism specific to the server or compute module. Verify thermal interface material is applied correctly between the heatsink base and the heat-generating component if required by the system guidance. After installation, confirm that airflow paths are unobstructed and that fans or system cooling subsystems are configured to provide adequate airflow.

Recommendations

Use this heatsink only in systems for which its size and thermal characteristics are confirmed compatible. Follow HP Enterprise or system vendor service manuals for torque specifications, retention procedures, and thermal interface material application. Regularly inspect mounting integrity and airflow clearance during maintenance intervals to ensure continued thermal performance.