Moederbord ASRock B860 Pro RS WiFi Intel B860 LGA1851 ATX, 4x DDR5-slots, 256GB, Wi-Fi 6E, 2.5GbE

The Race Sport (RS) Edition is a modern, performance-oriented motherboard based on the popular PRO series. Optimized for stability, durability and efficiency, it offers a balanced feature set for everyday computing and advanced use: a 10+1+1+1+1 power phase design with Dr. MOS, 6-layer PCB, DDR5 XMP/EXPO support, PCIe Gen5 Blazing M.2 and integrated Wi-Fi 6E and 2.5 Gb/s LAN for improved connectivity.

Advantages

The motherboard provides stable and smooth power delivery for CPU overclocking thanks to a multi-phase Dr. MOS design and Hi-Density power connectors. A 6-layer PCB and aluminum heatsinks improve thermal performance for memory and M.2 SSDs. Modern connectivity includes PCIe 5.0 M.2, USB 3.2 Gen2x2 Type-C, front USB Type-C header, dual graphics outputs (HDMI + DisplayPort), onboard RGB control (Polychrome RGB and SignalRGB) and high-quality audio with Nahimic enhancements. Network features include Wi‑Fi 6E (802.11ax/6GHz) and Realtek 2.5 Gb/s LAN for higher bandwidth and lower latency.

Key specifications

• Socket: Intel LGA 1851 (Socket V1) — supports Intel® Core™ Ultra Processors (Series 2)
• Chipset/layout: Intel B860, ATX form factor
• Power design: 10+1+1+1+1 Power Phase with Dr.MOS for VCore + GT + SA
• Memory: 4 × DDR5 DIMM, dual channel, up to 8666+ MHz (OC), maximum 256 GB; XMP & EXPO support
• PCIe slots: 1 × PCIe 5.0 x16, 1 × PCIe 4.0 x16
• M.2 / storage: 1 × Blazing M.2 (PCIe Gen5 x4), 2 × Hyper M.2 (PCIe Gen4 x4), 4 × SATA3
• USB: 1 × USB 3.2 Gen2x2 20 Gbps Type-C (rear), 1 × USB 3.2 Gen1 Type-C (front header), 8 × USB 3.2 Gen1, 6 × USB 2.0
• Ethernet & wireless: Realtek 2.5 Gb/s LAN, Wi‑Fi 6E (802.11ax/6GHz) + Bluetooth 5.3
• Audio: Realtek ALC897 7.1 CH HD Audio Codec with Nahimic Audio features
• Extras: Reinforced steel PCIe slot (PCIe 5.0 ready), M.2 bottom heatsink, BIOS Flashback, aluminum heatsinks, Polychrome RGB and SignalRGB support

How to use

Install the motherboard in an ATX-compatible case and mount the supported Intel LGA1851 Series 2 CPU following the manufacturer instructions. Insert DDR5 modules into the four DIMM slots and enable Intel XMP or AMD EXPO profiles in UEFI to apply tested overclocking settings if supported by the memory. Connect M.2 SSD(s) and SATA devices, secure the M.2 bottom heatsink, and attach power using the Hi-Density CPU and ATX connectors. Install graphics card(s) into the reinforced PCIe slots and connect display via HDMI or DisplayPort. For networking, enable Wi‑Fi 6E or connect via the 2.5 Gb/s LAN port. Update the UEFI BIOS if necessary and install drivers for chipset, audio (Nahimic) and networking to ensure full functionality.

Recommendations

Use high-quality DDR5 memory modules verified for XMP or EXPO to achieve stable overclocking results, and ensure your power supply provides sufficient current for Hi-Density connectors when performing heavy CPU overclocking. Maintain airflow over the M.2 and VRM heatsinks for optimal thermal performance.