Thermal pad Thermal Grizzly Minus Pad 8

The Thermal Grizzly Minus Pad 8 is a high-performance thermal pad with a thermal conductivity of 8 W/m·K. Made from a ceramic silicone complex and nano aluminum oxide (metal oxide and silicone base), it fills and compensates for small gaps between electronic components to ensure stable and efficient heat transfer. The pad measures 120 mm × 20 mm × 1 mm and functions across a wide temperature range from -100 to 250 °C, providing reliable thermal management for various assemblies.

Advantages

The Minus Pad 8 combines high thermal conductivity with strong compressibility while remaining electrically insulating. Its flexible, elastic surface conforms to uneven contact surfaces and the pads are easy to place and adhere with minimal pressure. The material composition ensures constant heat transfer, and the product is RoHS-compliant and environmentally friendly.

Suitable for

• Thermal coupling between heatsinks and chips in small electronics
• Gap filling in power modules, MOSFETs and voltage regulators
• Cooling interfaces in LED modules and compact PC components

Key specifications

• Thermal conductivity: 8 W/m·K
• Dimensions: 120 mm × 20 mm × 1 mm
• Operating temperature: -100 to 250 °C
• Material base: ceramic silicone complex with nano aluminum oxide (metal oxide and silicone)
• Electrical insulation: yes

How to use

Clean contact surfaces from dust, grease and old thermal materials before applying the pad. Cut the pad to the required size if necessary, remove any protective liners and position it between the components to be thermally connected. Apply light pressure to ensure full contact and compression; the pad will conform to small surface irregularities to establish optimal heat transfer.

Recommendations

For best results, use pads that cover the contact area without excessive overhang and avoid repeated removal and reapplication. Verify mechanical clearance and mounting pressure to ensure the pad remains compressed but not overly stressed during operation.